Comparison ledger
Accretech , Tokyo Semitsu Kogaku (TSK) UF200, Nordson Stratosphere Plasma Treatment, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | , Tokyo Semitsu Kogaku (TSK) UF200Accretech | |
|---|---|---|
| OEM | Accretech | Nordson |
| Category | — | — |
| Wafer size | Wafer Equipment | Wafer kit sensor |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Accretech , Tokyo Semitsu Kogaku (TSK) UF200 | Nordson Stratosphere Plasma Treatment |
| Specifications | ||
| Wafer size | Wafer Equipment[1] | Wafer kit sensor[2] |
| Date of Manufacture | 1998[1] | — |
| Currently Configured for | 200mm[1] | — |
| Current Equipment Status | Available[1] | — |
| Available date | Currently Available[1] | — |
| Equipment category | Production Wafer Prober[1] | — |
| Configuration | — | E-FEM, 300mm FOUP (2), ESD[2] |
| Manufacturer | — | Nordson[2] |
| Model | — | Stratosphere[2] |
| Tool family | — | Nordson Stratosphere Plasma Treatment[3] |
| Equipment type | — | Plasma Treatment System[2] |
| Process type | — | Parallel plate asher[2] |
| RF power range | — | 600 to 1000 W[2] |
| Chiller | — | Assy, Chiller, 1HP, 230V/60, 1/4"[2] |
| Vacuum | — | 16 CFM standard dry pump[2] |
| Gas delivery | — | 100 sccm MFC[2] |
| Wafer handling | — | Wafer kit sensor[4] |
| Wafer size kit | — | Wafer kit, 200/300mm hybrid[2] |
| Electrode water cooling | — | Included[2] |
| Electrode temperature sensor | — | F 3 electrode temperature sensor[2] |