Waferpedia

Comparison ledger

10100versus7600C

West Bond 10100, West Bond 7600C, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10100West Bond
7600CWest Bond
OEMWest BondWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyWest Bond 10100West Bond 7600C
Specifications
Bonding technology—Wedge[1]
Feed angle—90°[1]
Access type—Deep access[1]

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Sources (1)Every fact above is drawn from these public sources
  1. [1]semistarcorp.comsemistarcorp.com