Comparison ledger
Tegal 1511e, Tegal 983, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1511eTegal | 983Tegal |
|---|---|---|
| OEM | Tegal | Tegal |
| Category | Etch | Etch |
| Wafer size | three- to six-inch wafers | 125mm |
| Process node | — | down to 0.5 micron |
| Introduced | 1984 | — |
| Production run | 1984– | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Tegal 1511e | Tegal 983 |
| Specifications | ||
| tool type | tri-electrode dual-frequency plasma etch system[1] | — |
| wafer size | three- to six-inch wafers[1] | — |
| first sold | 1984[1] | — |
| system characteristic | first vacuum-loadlocked dual-frequency tri-electrode etch system[1] | — |
| First vacuum-loadlocked dual-frequency tri-electrode etch system | Yes[1] | — |
| Model | — | 983[2] |
| Product name | — | 983 ACS[2] |
| Category | — | Diode plasma etch tool[3] |
| Fixed electrode gap | — | 6 mm[3] |
| Round substrate size | — | 125 mm to 150 mm round silicon and GaAs substrates[3] |
| Rectangular substrate size | — | 125 mm to 150 mm on a side[3] |
| Best-suited design rules | — | down to 0.5 micron[3] |
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