Comparison ledger
SUSS MicroTec Delta 12 AQ, TEGAL 211, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Delta 12 AQSUSS MicroTec | 211TEGAL |
|---|---|---|
| OEM | SUSS MicroTec | TEGAL |
| Category | Resist Processing | Resist Processing |
| Wafer size | Wafer Developing System Configuration | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | SUSS MicroTec Delta | TEGAL 211 |
| Specifications | ||
| Configuration | Software is not included[1] | — |
| Maximum wafer diameter | 200 mm (8 in)[2] | — |
| Maximum substrate thickness | 5 mm[2] | — |
| Supported wafer diameters | 50 mm (2 in), 75 mm (3 in), 100 mm (4 in), 150 mm (6 in), 200 mm (8 in)[2] | — |
| Supported photomask sizes | 125 mm x 125 mm, 150 mm x 150 mm[2] | — |
| Supported developer chemistries | AZ400K, AZ300MIF, CD26[2] | — |
| Process type | temperature controlled spray photoresist development, cassette-to-cassette, dry in – dry out[2] | — |
| Operation control | Recipe controlled automated operation with precise temperature control[2] | — |
| Wafer size | Wafer Developing System Configuration | — |
| Vintage | 2009 | — |
| Coaters & Developers Vintage | 2009 | — |
| Development method | temperature controlled spray development[2] | — |
| Operation mode | cassette-to-cassette, recipe controlled[2] | — |
| Small pieces supported | No[2] | — |
| Refurbished RTP RTA | — | AG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[3] |
| KLA-Tencor Spare Parts and Service | — | RS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[3] |
| Refurbished Isotropic Plasma Etcher | — | Matrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[3] |
| Refurbished PECVD, ALD Equipment | — | Cambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[3] |
| Refurbished Mask Aligner | — | Canon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[3] |
| Refurbished Bonding | — | SUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[3] |
| Refurbished Wafer Prober | — | Electroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[3] |
| Process Type | — | Plasma Asher/Etcher[4] |
| Wafer Size (max) | — | 3 inch[4] |
| Form Factor | — | Table top[4] |
| Chamber Material | — | Aluminum[3] |
| Chamber Internal Dimensions | — | 6 x 6 x 3.75 inches[3] |
| Timer Range | — | 0-99 minutes[4] |
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