Waferpedia

Comparison ledger

ACS 200 +versus1000 Family

SUSS MicroTec ACS 200 +, Ultratech 1000 Family, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
ACS 200 +SUSS MicroTec
1000 FamilyUltratech
OEMSUSS MicroTecUltratech
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilySUSS MicroTec ACS 200Ultratech 1000 Family
Cited variants—
Specifications
Voltage400 V[1]—
Phase3 Phase[1]—
Frequency60 Hz[1]—
ConfigurationWith Gencobot 7S / 3L Transfer Robot[1]—
OEMSUSS MicroTec[1]—
ModelACS 200 +[1]—
Wafer Sizes6 inch[1]—
Vintage2007[1]—
Transfer RobotGencobot 7S / 3L[1]—
Developer ModulenDeveloper Module[1]—
Solvent Developer ModuleYes[1]—
Coater ModuleYes[1]—
Thermal Module2 hotplates, 1 chillplate[1]—
ControllerKontron[1]—
Media Storage Tanks4[1]—
Media Control BoxSUSS[1]—
Recirculating ChillersJulabo F30-CL (2), Julabo FC 600 S (2)[1]—
Power Requirements400 V, 3 Phase, 60 Hz[1]—
ManufacturerSUSS[1]—
Equipment typeCoater / Developer[1]—
Developer module typeSolvent developer module[1]—
Coater moduleCoater module[1]—
Thermal moduleThermal module with 2 hotplates (1 ea chillplate)[1]—
Tool type—Photolithography step-and-repeat 1X stepper[2]
Optical design—Wynne Dyson[2]
Magnification—1X[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]en.wikipedia.orgen.wikipedia.org