Waferpedia

Comparison ledger

UTC 200 Superversus10100

Shinkawa UTC 200 Super, West Bond 10100, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
10100West Bond
OEMShinkawaWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyShinkawa UTC 200 SuperWest Bond 10100
Specifications
CategoryPackaging & Bonding[1]—
Equipment typeWire Bonder[2]—

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Sources (2)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]Equipment inventory listing