Comparison ledger
Palomar 8000, Palomar 8000 i, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 8000Palomar | 8000 iPalomar |
|---|---|---|
| OEM | Palomar | Palomar |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 2013 system debut |
| Control system | — | — |
| Generation | — | — |
| Family | Palomar 8000 | Palomar 8000 |
| Cited variants | — |
|
| Specifications | ||
| Configuration | 200-240 V[2] | upgraded to a 120kHz transducer[6] |
| Phase | 1 Phase[2] | — |
| Operating System | Windows XP[3] | — |
| Voltage | 200-240 V[2] | — |
| Current | 25 Amps[2] | — |
| Frequency | 50/60 Hz[2] | — |
| Vintage | 2010[3] | 2019 Vintage[6] |
| Equipment type | Wire bonder[2] | — |
| Make | Palomar[2] | — |
| Model | 8000[2] | 8000 i[6] |
| Power | 200-240 V, 25 Amps, 50/60 Hz, 1 Phase[2] | 200, 208, 220, or 240 VAC, 50/60 Hz, 30A, single phase[7] |
| Asset # | — | 81383[6] |
| Type | — | Wire Bonder[6] |
| Description | — | upgraded to a 120kHz transducer[6] |
| System debut | — | Debut of the 8000i Wire Bonder/Ball Bumper in 2013[1] |
| Bond type | — | Thermosonic ball and wire bonding, ball bumping[7] |
| Cycle time | — | 0.125 sec/wire; 0.077 sec/bump[7] |
| Wire pitch | — | 50 μm using 20 μm wire[7] |
| Repeatability | — | +/- 2.5 μm, 3σ[7] |
| Deep access capillary | — | Standard: 11.10 mm; Optional: 11.94 mm / 15.88 mm / 19.05 mm[7] |
| Bond area | — | 304.8 x 152.4 mm (12" x 6")[7] |
| Wire spool size | — | 50.8 mm (2") double flanged spool[7] |
| Wire diameter | — | 17.8 to 50.8 μm (0.7 to 2.0 mil)[7] |
| Vacuum | — | -25 inHg (85 kPa)[7] |
| Air at bonder inlet | — | CDA: 60 psig @ 4 SCFM[7] |
| Dimensions | — | Height: 1,778 mm (70"); Footprint: 800 x 953 mm (31.5" x 37.5")[7] |
| Weight | — | 1,800 lbs. (816.47 kg)[7] |
| Control system | — | Linear motor/encoder (X/Y), voice coil/encoder (Z linear / Z rotary), Servo EFO/encoder[7] |
| Bonding mode | — | Thermosonic ball and wire bonding, ball bumping[7] |
| Capabilities | — | Ball bumping, stud bumping, wafer bumping, chip bumping, customized looping profiles[7] |
| Resolution | — | 0.10 μm X/Y axis[7] |
| Vision system | — | Cognex Series 8500[7] |
| Applications | — | Large complex hybrids, HB/HP LED arrays, optoelectronic packaging, chip-on-board (COB), system in packages (SiPs), specialty lead frames, automotive assemblies, flex circuits, multi-chip modules (MCMs), fine pitch devices, LEDs with running stitch[7] |
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