Comparison ledger
Oxford Instruments PRS900, Thermo Fisher 1300 Series Safety, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | PRS900Oxford Instruments | 1300 Series SafetyThermo Fisher |
|---|---|---|
| OEM | Oxford Instruments | Thermo Fisher |
| Category | Wet Processing / Clean | Wet Processing / Clean |
| Wafer size | 6" | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 2026 Third-party support only |
| Control system | — | — |
| Generation | — | — |
| Family | Oxford Instruments PRS900 | Thermo Fisher 1300 |
| Specifications | ||
| Tool type | plasma stripper; barrel reactor[1] | — |
| Process | dedicated to dry resist stripping[1] | — |
| Etching character | purely chemical and isotropic[1] | — |
| Plasma source | oxygen plasma (RF capacitive or micro-wave)[1] | — |
| Automation | completely computer driven[1] | — |
| Carrier | quartz samples carrier[1] | — |
| Carrier wafer size | 4 or 6 inches[1] | — |
| Batch capacity | up to 25 wafers[1] | — |
| Resistance etch rate used at CMi | 0.035 um/min[1] | — |
| Type | Barrel reactor[1] | — |
| Chamber configuration | Barrel acts as Faraday cage, RF waves do not enter chamber; plasma UV radiations not filtered[1] | — |
| Maximum wafers per batch | 25[1] | — |
| Wafer carrier | Quartz samples carrier (4 or 6 inches)[1] | — |
| Mean resist etch rate | 0.035 µm/min for PR (for 5, 30, or 60 min recipes)[1] | — |
| Computer control | Completely computer driven[1] | — |
| Etch type | Purely chemical, isotropic[1] | — |
| Wafer carrier sizes | 4 or 6 inches[1] | — |
| Mean PR etch rate | 0.035 µm/min[1] | — |
| Standard process recipes | PR Ox5 (5 min), PR Ox30 (30 min), PR Ox60 (60 min)[1] | — |
| Reactor type | Barrel reactor[1] | — |
| Process type | Dry resist stripping; etching processes are purely chemical and isotropic[1] | — |
| Reactor shielding | The barrel acts as a Faraday cage so RF waves do not enter the treatment chamber[1] | — |
| UV behavior | Plasma UV radiations are not filtered and thermally activate the oxidation[1] | — |
| Control | Completely computer driven; the only manual handling is the loading/unloading step of the quartz samples carrier[1] | — |
| Recipe PR Ox5 (5 min) | Mean etch rate 0.035 µm/min; stripping of PR residuals after photolithography[1] | — |
| Recipe PR Ox30 (30 min) | Mean etch rate 0.035 µm/min; stripping of ~1 µm of PR[1] | — |
| Recipe PR Ox60 (60 min) | Mean etch rate 0.035 µm/min; stripping of ~2 µm of PR[1] | — |
| Forbidden materials | Cu, Ag, Au, Cr — equipment must remain microelectronic compatible[1] | — |
| Primary use | dry resist stripping[1] | — |
| Carrier type | quartz samples carrier[1] | — |
| Carrier capacity | up to 25 wafers[1] | — |
| Configuration | — | Class II[2] |
| Cabinet type | — | Class II, Type A2 biological safety cabinet[3] |
| Airflow compensation | — | SmartFlow airflow compensation system[3] |
| Motors | — | Dual DC motors[3] |
| Front window design | — | SmartClean front window design[3] |
| Control panel | — | Intuitive control panel with constant readout of downflow and inflow velocities and filter reserve status[3] |
| UV light | — | Programmable UV light[3] |
| SmartPort | — | SmartPort convenience for routing tubing and cables through the side walls[3] |
| Available widths | — | 3-foot, 4-foot, 5-foot, and 6-foot sizes[3] |
| Front opening choices | — | 8-inch or 10-inch front opening[3] |
| Filter specification | — | H14 HEPA filters, EN 1822, 99.995% @ MPPS[4] |
| Certification | — | NSF/ANSI 49, UL, CE[4] |
| Service valves | — | Up to 6 total, 3 on each side wall[4] |
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