Waferpedia

Comparison ledger

WG6versus100R16

Logitech WG6, Strasbaugh 100R16, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
WG6Logitech
100R16Strasbaugh
OEMLogitechStrasbaugh
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control systemGUI—
Generation——
FamilyLogitech WG6Strasbaugh 100R16
Specifications
System compositionPM6 or LP70 precision polishing machine plus WG6 polishing head[1]—
Batch capacityUp to 6 samples at one time[1]—
LP70 capacity with two WG6 headsUp to 12 specimens at one time[1]—
Polishing head speedUp to 35 rpm[1]—
Incremental load per drive rodUp to 1.4 kg on each individual drive rod[1]—
Drive rodsSix drive rods[1]—
MotorPowerful, low voltage DC motor[1]—
MaterialCorrosion resistant materials[1]—
Large specimen example size76 x 51 mm[1]—
type—1 spindle grinder/polisher[2]
drive system—DC drive system with 2 motors[2]
spindle RPM—1-180 RPM[2]
eccentric RPM—1-90 RPM[2]
controls—digital timer; air down switch; spindle and eccentric speed dials; air regulators[2]
capacity—16 inches[2]
spindle size—1-8 TPI[2]
overall dimensions—28 inches x 36 inches x 48 inches[2]
weight—500 lbs[2]
origin—made in the USA[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]excelltechnology.comexcelltechnology.com