Waferpedia

Comparison ledger

EP1versus100R16

Logitech EP1, Strasbaugh 100R16, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
EP1Logitech
100R16Strasbaugh
OEMLogitechStrasbaugh
CategoryCMPCMP
Wafer size100mm—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLogitech EP1Strasbaugh 100R16
Specifications
Product familyEP Polishing Pads and Cloths[1]—
Application typeChemical Mechanical Polishing (CMP)[1]—
Suitable applicationsoxide, nitride and copper[1]—
TypeChemical Mechanical Polishing (CMP) cloths and pads[1]—
Suitable materialsOxide, nitride and copper[1]—
Product typeChemical Mechanical Polishing (CMP) polishing cloths and pads[1]—
Applicationsoxide, nitride, and copper[1]—
Associated wafer process capacityup to 100mm/4"[2]—
type—1 spindle grinder/polisher[3]
drive system—DC drive system with 2 motors[3]
spindle RPM—1-180 RPM[3]
eccentric RPM—1-90 RPM[3]
controls—digital timer; air down switch; spindle and eccentric speed dials; air regulators[3]
capacity—16 inches[3]
spindle size—1-8 TPI[3]
overall dimensions—28 inches x 36 inches x 48 inches[3]
weight—500 lbs[3]
origin—made in the USA[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]web.archive.orgweb.archive.org
  3. [3]excelltechnology.comexcelltechnology.com