Comparison ledger
Lapmaster 12 Lapper, PR Hoffman 108T, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 12 LapperLapmaster | 108TPR Hoffman |
|---|---|---|
| OEM | Lapmaster | PR Hoffman |
| Category | CMP | CMP |
| Wafer size | — | up to 12 in wafers |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | — | PR Hoffman 108T |
| Specifications | ||
| Outside plate diameter | 12 inches[1] | — |
| Lapping Speed Range | 0 to 60 rpm[2] | — |
| Wafer Size Compatibility | 4 inches or smaller[1] | — |
| Input Voltage | 110 V[1] | — |
| Frequency | 60 Hz[1] | — |
| Phase | 1[1] | — |
| Number of Rings | 3[1] | — |
| Number of Weights | 3[1] | — |
| Includes Slurry System | Yes[1] | — |
| Includes Timer | Yes[1] | — |
| carrier type listing | — | 108T 9B - S/F / Lapmaster LSP-9 / etc.[3] |
| machine class | — | for double-sided planetary lapping & polishing machines[3] |
| wafer sizes stated on insert-carrier page | — | 3 in, 4 in, 5 in, 6 in, 8 in, and 12 in wafers[3] |
| maximum carrier diameter stated on insert-carrier page | — | up to 33 in diameter[3] |
| maximum carrier diameter stated on lapping-carrier page | — | up to 48 in diameter[4] |