Comparison ledger
Lam Research TCP 9400 SE, Oxford Instruments 100 ICP Fluorine, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | TCP 9400 SELam Research | 100 ICP FluorineOxford Instruments |
|---|---|---|
| OEM | Lam Research | Oxford Instruments |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lam Research TCP 9400 SE | Oxford Instruments 100 ICP Fluorine |
| Cited variants | — | |
| Specifications | ||
| Software Revision | E1.6.1-002[3] | — |
| Main UI PN | PC NEXT 33[3] | — |
| ESC | 718-094523-281[3] | — |
| Liner | 715-030329-002[3] | — |
| GAZ Box Réf | 853-024403-104[3] | — |
| Platform | Rainbow[4] | — |
| Source type | Inductively coupled (TCP)[4] | — |
| Wafer size | 200 mm (8 inch)[3] | 4 inch, 6 inch, 8 inch (with clamp change)[5] |
| Chamber configuration | Single chamber[4] | — |
| Wafer transport | Cassette to cassette[4] | — |
| Vacuum pump | Leybold TURBOVAC 1000C[1] | — |
| Software version | Envision version 1.4[1] | — |
| End point detection | Emission and interferometric[4] | — |
| Ceramic free chamber | Yes[1] | — |
| Waferless auto clean (WAC) | Yes[1] | — |
| CE Certified | Yes[1] | — |
| Etch Gases | — | SF6, CF4, O2, Ar, N2, CHF3, C4F8[5] |
| Cryo DRIE etch rate | — | up to 5 µm/min[5] |
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