Comparison ledger
Lam Research 2300, Oxford Instruments 100 ICP Fluorine, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 2300Lam Research | 100 ICP FluorineOxford Instruments |
|---|---|---|
| OEM | Lam Research | Oxford Instruments |
| Category | Etch | Etch |
| Wafer size | 8" | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lam Research 2300 | Oxford Instruments 100 ICP Fluorine |
| Cited variants | — | |
| Specifications | ||
| 3 Chambers | Insulating Film, Metal, Ashing[1] | — |
| Wafer size | Wafer set up for 8"[1] | 4 inch, 6 inch, 8 inch (with clamp change)[4] |
| Configuration | With Exelan Flex 45 Dielectric Etch Chamber[1] | — |
| Wafer sizes supported | 8 inch, 12 inch[1] | — |
| Chamber configuration | 3 chambers: Insulating Film, Metal, Ashing[1] | — |
| Wafer setup | Wafer set up for 8 inch[1] | — |
| Dielectric etch chamber | Exelan Flex 45 Dielectric Etch Chamber[1] | — |
| Included subsystems | HDD & Software included; all pumps, generators & other subsystems included[1] | — |
| CE Mark | CE Mark 2023 Vintage[1] | — |
| Configuration (12-inch) | KIYO EXP MRT[2] | — |
| OEM | Lam Research[1] | — |
| Model | 2300[1] | — |
| Category | Etch[1] | — |
| Wafer sizes | 8 inch, 12 inch[1] | — |
| Etch Gases | — | SF6, CF4, O2, Ar, N2, CHF3, C4F8[4] |
| Cryo DRIE etch rate | — | up to 5 µm/min[4] |
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