Comparison ledger
KLA Profilm 3 D Optical, KLA Profilm 3D Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ||
|---|---|---|
| OEM | KLA | KLA |
| Category | Metrology & Inspection | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA Profilm | KLA Profilm |
| Specifications | ||
| Configuration | OBJ-10X-Mirau 10x Nikon Mirau interferometric objective lens[1] | — |
| Measurement principle | Vertical Scanning Interferometry (VSI) and Phase-Shifting Interferometry (PSI)[2] | — |
| Thickness range (VSI) | 50 nm – 100 mm[2] | — |
| Thickness range (PSI) | 0 – 3 µm[2] | — |
| Reflectance range | 0.05% – 100%[2] | — |
| Piezo scan range | 500 µm[2] | — |
| XY stage options | 100 mm × 100 mm or 200 mm × 200 mm[2] | — |
| Objectives | 5X, 10X, 20X, 50X, 100X[3] | — |
| Sample max width | 265 mm (Profilm3D); 365 mm (Profilm3D-200)[3] | — |
| System weight | 15 kg (Profilm3D); 22 kg (Profilm3D-200)[3] | — |
| Model configuration | OBJ-10X-Mirau 10x Nikon Mirau interferometric objective lens; WSProfilm3D-200 manual rotating (r-theta) stage for 200mm wafers; Profilm-AnalysisSoftware permanent license; UPG-PSI upgrade; Accurion Nano30 active vibration isolation system; stitching not included[1] | — |
| Objective | — | 100x[4] |
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