Comparison ledger
KLA D600, Onto Innovation RPM 2000 PL Mapper, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | D600KLA | RPM 2000 PL MapperOnto Innovation |
|---|---|---|
| OEM | KLA | Onto Innovation |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | 2" | 2" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | D-series | — |
| Family | KLA D600 | Onto Innovation RPM 2000 PL Mapper |
| Specifications | ||
| Instrument type | Stylus surface profiler[1] | — |
| Measurement purpose | Thin and thick film step height measurement[1] | — |
| Wafer compatibility | 2", 4", 6", and 8" wafers[1] | — |
| Field of view | 3780 x 3120 um[1] | — |
| Digital zoom | x4[1] | — |
| Scan length range | 55 mm with stitching option[1] | — |
| Vertical range | 1 mm[1] | — |
| Step-height repeatability | 5A[1] | — |
| Force range | 0.03 to 15 mg[1] | — |
| Digital Zoom | 4x digital zoom[1] | — |
| Step-Height Repeatability | 5A (5 angstroms)[1] | — |
| Measurement application | Advanced thin- and thick-film step height measurement[1] | — |
| Documentation | D Series User Manual[1] | — |
| Type | stylus surface profiler[1] | — |
| Measurement function | thin and thick film step height measurement[1] | — |
| Configuration | — | 785nm and almost new 532nm lasers (suitable for most As-P materials)[2] |
| Wafer size | — | 2"-6" wafer size range[2] |
| OEM | — | ONTO / Nanometrics[2] |
| Model | — | RPM 2000[2] |
| Wafer sizes | — | 2, 3, 4, 5, 6 inch[2] |
| Wafer chuck | — | 2" and 3" wafer chuck[3] |
| Laser wavelength | — | 785nm and almost new 532nm lasers[2] |
| Detectors | — | InGaAs and Si CCD detectors[2] |
| Light source | — | White light source[2] |
| Measurement applications | — | Thickness, VCSEL, DBR measurements[2] |
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