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Comparison ledger

2367versus2367 Brightfield

KLA 2367, KLA 2367 Brightfield, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
2367KLA
OEMKLAKLA
CategoryMetrology & InspectionMetrology & Inspection
Wafer sizeOnly one wafer size at a time—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyKLA 2367KLA 2367
Specifications
SW Version10.4.507[1]—
Wafer sizeOnly one wafer size at a time[1]—
300 mm (12")Yaskawa + Asyst ISO Port or[1]—
ConfigurationShinko LP[1]ORS Upgrade[3]
200 mm (8")Yaskawa + Asyst Versa Port (SMIF)[1]—
GLG Line[1]—
ILI Line[1]—
VISVisible[1]—
Equipment typeUV/visible brightfield inspector[2]—
Inspection focussensitivity to a broad range of yield-relevant defect types[2]—
Design node65nm and above[2]—
Wafer sizes8 inch, 12 inch[1]—
Wafer handlingonly one wafer size at a time[1]—
Software version10.4.507[1]—
Lighting modesGL: G Line; IL: I Line; VIS: Visible[1]—
Inspection thresholds0.12 UV/GL/IL; 0.16 UV/GL/IL; 0.20 UV/GL/IL; 0.25 VIS; 0.39 VIS; 0.62 VIS[1]—
Power Requirements—208 V, 16 A, 50 / 60 Hz, 3 Phase[3]
CE Marked—Yes[3]
OEM—KLA[3]
Model—2367 Brightfield[3]
Category—Metrology & Inspection[4]
Description—brightfield inspection system[4]
Wafer support—200 mm cassettes[3]
Cassette HW—25 cassette HW 200 mm[3]
Model support—GEM/SECS and HSMS[3]
Pixels enabled—.12, .62, .39[3]
Vintage—2017[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com