Comparison ledger
KLA .204 PSL Wafer, Koh Young KY 8080 3D, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | KY 8080 3DKoh Young | |
|---|---|---|
| OEM | KLA | Koh Young |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA .204 PSL Wafer | — |
| Specifications | ||
| Configuration | NIST Traceable[1] | — |
| Wafer Size | 8 inch[1] | — |
| Traceability | NIST[2] | — |
| Compatible Tools | Surfscan 6xy0, Sp1[1] | — |
| NIST Traceable | Yes[1] | — |
| Equipment type | — | 3D Solder Paste Inspection[3] |
| Category | — | Metrology & Inspection[3] |
| Minimum component | — | 01005[4] |
| PCB size | — | 350x330mm[4] |
| Dimensions | — | 1000x1335x1627mm[4] |
| Weight | — | 600kg[4] |
| Inspection range | — | Volume, Area, Height, Offset, Bridging and Shape Deformity[4] |
| Defects detected | — | Insufficient/Excessive/Missing Paste, Bridging, Shape Deformity and Paste Offset[4] |
| Measurement principle | — | 3D Shadow Free Moiré Camera Technology[4] |
| Camera | — | 2MPix[4] |
| XY pixel resolution | — | 20 µm[4] |
| Z resolution | — | 0.37 µm[4] |
| Inspection speed at 20 u m shadow free mode | — | 15.0 cm²/sec[4] |
| Inspection speed at 20 u m high speed mode | — | 19.7 cm²/sec[4] |
| Volume repeatability | — | < 1% at 3 sigma (on a KY Calibration Target); < 3% at 3 sigma (on a PCB)[4] |
| Height accuracy | — | 2 m m[4] |
| Gage R&R | — | < 10% at 6 Sigma (± 50 tolerance)[4] |
| Max PCB warp | — | ± 3.5 mm[4] |
| Max paste height | — | 400 u m[4] |
| Min paste deposit size at 20 u m rectangle | — | 150 u m[4] |
| Min paste deposit size at 20 u m circle | — | 200 u m[4] |
| Conveyor width adjustment | — | Automatic[4] |
| Conveyor fix type | — | Front/Rear Fixed (Factory Setting)[4] |
| Conveyor height | — | 970 ~ 870 mm[4] |
| Supply electrical | — | 200 ~ 240VAC, 50/60 Hz Single phase[4] |
| Air | — | 5 Kgf/cm²[4] |
| Operating system | — | Windows XP Professiona[4] |
| S/W statistical analysis tool | — | SPC Plus[4] |
| Inspection program generation | — | Import GERBER Data (274X, 274D)[4] |
| Options | — | Zoom Head (15, 20, 30 mm Autozoom); Off-line SPC & Defect Review Station; Off-line Programming Station; ODB++ File Conversion; Barcode Reader (1D/2D); HDD Raid 1 (Mirrored); Certified Calibration Target; UPS[4] |
| Inspection speed at 20 µm shadow free mode | — | 15.0 cm²/sec[3] |
| Inspection speed at 20 µm high speed mode | — | 19.7 cm²/sec[3] |
| Min paste deposit size at 20 µm rectangle | — | 150 µm[3] |
| Min paste deposit size at 20 µm circle | — | 200 µm[3] |
| Power | — | 200 ~ 240VAC, 50/60 Hz Single phase[3] |
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