Waferpedia

Comparison ledger

0035235-003 MMD HeadversusUltra Fusion Series

KLA 0035235-003 MMD Head, Orbotech Ultra Fusion Series, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMKLAOrbotech
CategoryMetrology & InspectionMetrology & Inspection
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyKLA 0035235-003 MMD HeadOrbotech Ultra Fusion Series
Specifications
ConfigurationTSTD PCB ASSY, MMD MEAS HEAD[1]—
Model0035235-003[1]—
MakeKLA[1]—
Part DescriptionTSTD PCB ASSY, MMD MEAS HEAD[1]—
Compatible SystemKLA AIT-XP[1]—
Min L/S [μm]—5/5[2]
Min defect size [μm]—1.2[2]
Auto focus—Yes[2]
Vibrations—No[2]
Magnification—220x-5000x[2]
Field of View—1.2mm – 0.19mm[2]
White Illumination—3 independently controlled Illumination types (LED-based): coaxial, diffusive, grazing[2]
UV Illumination—Controllable UV illumination[2]
Image processing—Yes[2]
Average time between defects [s]—0.7[2]
Image Display—23"[2]
Operating system—Linux[2]
Min L/S—5/5 μm[2]
Min defect size—1.2 μm[2]
Average time between defects—0.7 s[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing