Waferpedia

Comparison ledger

MA6/BA6versus150 e Mask

Karl Suss MA6/BA6, SUSS MicroTec 150 e Mask, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
MA6/BA6Karl Suss
150 e MaskSUSS MicroTec
OEMKarl SussSUSS MicroTec
CategoryLithographyLithography
Wafer sizeSamples ranging in size from 10mm to 150mm—
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyKarl Suss MA6/BA6SUSS MicroTec 150 e Mask
Specifications
OEMKarl Suss[1]—
ModelMA6/BA6[1]—
CategoryFrontside/Backside Mask Aligner[2]—
ApplicationFor topside or backside photo alignment and exposure[1]—
Backside alignmentEquipped with backside align capability with automated image capture and computer display optics[2]—
Exposure wavelengths350-450nm[2]—
Lamp house350W lamp house containing a 350W mercury short-arc lamp[2]—
Exposure modesHard contact, soft contact, proximity, and vacuum contact[2]—
ResolutionLine/space resolution of <1.0 microns under optimum conditions[2]—
Alignment accuracy0.25 microns under optimum conditions[2]—
Constant intensity controlConstant intensity controller (CIS) regulates lamp power to deliver constant intensity exposures[2]—
Sample size range10mm to 150mm[2]—
Mask size range4" to 7" sq.[2]—
Minimum mask thickness.09"[2]—

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Sources (2)Every fact above is drawn from these public sources
  1. [1]smif.pratt.duke.edusmif.pratt.duke.edu
  2. [2]smif.pratt.duke.edusmif.pratt.duke.edu