Waferpedia

Comparison ledger

R50versusZ3D-7000

Filmetrics R50, Zygo Z3D-7000, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
R50Filmetrics
OEMFilmetricsZygo
CategoryMetrology & InspectionMetrology & Inspection
Wafer size200mm200mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation—5th generation
FamilyFilmetrics R50Zygo Z3D-7000
Specifications
Default configurationconfigured by default for metallic layers[1]—
Default sample thickness525 um +/- 25 um[1]—
Equipment sectionMetrology[1]—
Related equipment on same page groupAIT CMT-SR2000N 4-Point Probe Measurement System; MPI TS150 Probe Station[1]—
Measurement type4-point probe[1]Non-contacting, non-destructive optical metrology[2]
Default materialmetallic layers[1]—
Wafer sizes—200 mm and 300 mm wafers[2]
Bridge-tool configuration—Can be configured to simultaneously handle both wafer sizes[2]
Key features—High speed non-contacting metrology; simultaneously measures multiple parameters; ISO Class 2, S2/S8, and CE certified; SEMI E95 compliant software; modular IntelliSensors reduce MTBR[2]
Technology—ZYGO's fifth generation interferometric technology[2]
Software—MetroPro software[2]
Loaded wafers—FOUPS and/or open cassettes[2]
Throughput—Exceeds throughput of contact technologies (profilers, atomic force microscopes) by a factor of 10[2]
Simultaneous measurements—Film thickness, critical dimensions, overlay, trench depth, and general surface topography[2]
Precision—Sub-nanometer precision for critical etch depth processes[2]
Wafer loading—FOUPS and/or open cassettes, pre-alignment, super flat chuck[2]
Certifications—ISO Class 2, S2/S8, CE certified[2]
Software compliance—SEMI E95 compliant[2]
Modular sensors—IntelliSensors reduce MTBR[2]
Algorithms—OneShot, TopSlice, FilmSlice[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]epfl.chepfl.ch
  2. [2]web.archive.orgweb.archive.org