Comparison ledger
EV Group Gemini Automated Production Wafer, SUSS MicroTec XB8, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | XB8SUSS MicroTec | |
|---|---|---|
| OEM | EV Group | SUSS MicroTec |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | 200mm | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group Gemini Automated | SUSS MicroTec XB8 |
| Specifications | ||
| Configuration | with Face to Face Alignment[1] | — |
| Wafer size | up to 8"/200mm[1] | — |
| Tooling included | 8” bond chucks (additional tooling can be offered)[1] | — |
| Temperature | 4 Bond modules with up to 550°C and 20kN bond force[1] | — |
| Automation | Fully automated wafer loading, alignment, bonding and unloading[2] | Semi-automated[3] |
| Alignment | Face to face alignment[1] | — |
| Alignment options | Bottom side, IR or SmartView alignment[2] | — |
| Bonding chambers | Multiple bonding chambers, up to ten[2] | — |
| Bonding modes | Anodic, thermo-compression or silicon fusion bonding[2] | — |
| Contact force | up to 40 kN[2] | — |
| Alignment module | SmartView®NT Alignment Module with 5x Objectives[1] | — |
| Bond modules | 4 Bond modules[1] | — |
| Bond force | 20 kN bond force[1] | — |
| Process gas | 1 purge gas line for process gas[1] | — |
| Software | EVG CIM Framework Software GUI[1] | — |
| Loaded features | Flexible process flow definition, drag and drop recipe programming, parallel processing of multiple jobs, automated recording of process and machine parameters, throughput optimized handling sequence, password protected user access levels, open cassette loading with empty/present sensor[1] | — |
| Design | Modular design with swap-in modules[2] | — |
| Cleanroom compatibility | Class 1 clean room compatible design[2] | — |
| Temperature uniformity | Excellent temperature uniformity, stability and reproducibility[2] | — |
| Certification | CE Certified[1] | — |
| Vintage | 2014 Vintage[1] | — |
| Wafer size (max) | — | 200 mm[3] |
| Process | — | High-Force Wafer Bonding[3] |
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