Comparison ledger
EV Group 850 LT SOI Fusion Wafer, SUSS MicroTec XB8, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 850 LT SOI Fusion WaferEV Group | XB8SUSS MicroTec |
|---|---|---|
| OEM | EV Group | SUSS MicroTec |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | 200mm | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 850 | SUSS MicroTec XB8 |
| Specifications | ||
| Configuration | Fully-Automatic[1] | — |
| Wafer size | Suitable for wafer sizes up to 8"/200mm wafers[1] | — |
| Wafer size (max) | — | 200 mm[2] |
| Automation | — | Semi-automated[2] |
| Process | — | High-Force Wafer Bonding[2] |
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