Comparison ledger
EV Group 520, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 520EV Group | 1 WBS 1 Wafer SubstrateLogitech |
|---|---|---|
| OEM | EV Group | Logitech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | Manual wafer load substrate bonder | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 520 | Logitech 1 WBS 1 Wafer Substrate |
| Cited variants |
| — |
| Specifications | ||
| Configuration | Refurbished[2] | — |
| Phase | 3 Phase[2] | — |
| Wafer size | Manual wafer load substrate bonder[2] | — |
| Wafer Size | up to 150 mm capable[2] | 6 inch[3] |
| Vacuum Chuck | 6"/150mm diameter chuck[2] | — |
| Max Bond Force | 7 kN[2] | — |
| Top Side Heater | 550°C max. in 1°C steps[2] | — |
| Bottom Side Heater | 550°C max. in 1°C steps[2] | — |
| Temperature uniformity | ± 1,5 %[2] | — |
| OEM | EV Group[2] | — |
| Model | 520[2] | — |
| Load type | Manual wafer load substrate bonder[2] | — |
| Wafer size (as configured) | 6 inch[2] | — |
| Wafer size capability | up to 150 mm capable[2] | — |
| Max bond force (configured system) | 7 kN[2] | — |
| Top side heater max temperature | 550°C max. in 1°C steps[2] | — |
| Bottom side heater max temperature | 550°C max. in 1°C steps[2] | — |
| Power requirements | 50 / 60 Hz - 120 / 208 V - 3 Phase[2] | — |
| Bonding capability (configured system) | Fusion & thermal compression bonding; anodic bonding[2] | — |
| Bond chamber | High-vacuum capable bond chamber[2] | — |
| Bond tool cover | Auto opening of bond tool cover[2] | — |
| Control software | Windows based control software and operation interface[2] | — |
| Chiller | Thermoflex 1400 Chiller (or equivalent)[2] | — |
| Pumping | Turbo pump and controller; roughing pump[2] | — |
| System configuration (EVG520 IS) | Single or dual chamber wafer bonding system[1] | — |
| Automation (EVG520 IS) | Fully automated processing with manual loading and unloading including external cooling station[1] | — |
| Aligner compatibility (EVG520 IS) | Compatible with EVG mechanical and optical aligners[1] | — |
| Chambers (EVG520 IS) | Single- or double-chamber automated system[1] | — |
| Cooling (EVG520 IS) | Integrated cooling station for high throughput; active water cooling top and bottom; integrated cooling optional[1] | — |
| Max contact force (EVG520 IS) | 10, 20, 60, 100 kN[1] | — |
| Heater size (EVG520 IS) | 150 mm, 200 mm[1] | — |
| Minimum substrate dimension (EVG520 IS) | single chips 100 mm[1] | — |
| Vacuum standard (EVG520 IS) | 1E-5 mbar[1] | — |
| Vacuum optional (EVG520 IS) | 1E-6 mbar[1] | — |
| Max temperature (EVG520 IS) | Standard: 550 °C; Optional: 650 °C[1] | — |
| Single chips processing (EVG520 IS) | Yes[1] | — |
| Loading chamber (EVG520 IS) | Manual[1] | — |
| Max bond chambers (EVG520 IS) | 2[1] | — |
| Anodic bonding power supply (EVG520 IS) | Max. voltage: 2 kV; max. current: 50 mA[1] | — |
| Chuck / alignment systems (EVG520 IS) | 150 mm heater: EVG 610, EVG 620, EVG 6200; 200 mm heater: EVG 6200, SmartView NT[1] | — |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →