Waferpedia

Comparison ledger

101versusMA 150

EV Group 101, SUSS MicroTec MA 150, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
101EV Group
MA 150SUSS MicroTec
OEMEV GroupSUSS MicroTec
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones—1995 1995 vintage · 2012 Third-party support only
Control system——
Generation——
FamilyEV Group 101SUSS MicroTec MA 150
Cited variants—
Specifications
OEMEV Group[2]—
Model101[2]—
Equipment nameEVG 101 Spray Coater[2]—
NEMO IDevgspraycoat[2]—
Training requiredEVG 101 Training[2]—
Training duration1.50 hours[2]—
Processing techniqueResist Spray Coat (manual)[2]—
Cleanliness"All"[2]—
LocationSNF Paul G Allen L107 Cleanroom[2]—
Wafer diameter (substrate size)up to 300 mm[3]—
Available modulesSpin coat / OmniSpray® / develop[3]—
Wafer handling optionsBowed / warped / thin wafer handling, edge handling[3]—
Dispense optionsVarious resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[3]—
Processing technique (at SNF)Resist Spray Coat (manual)[4]—
Cleanliness group (at SNF)"All"[2]—
Voltage—230 V[5]
Configuration—3200 VA[5]
Frequency—50 Hz[5]

Plan your fab

Building a Lithography process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]snfguide.stanford.edusnfguide.stanford.edu
  3. [3]evgroup.comevgroup.com
  4. [4]snfguide.stanford.edusnfguide.stanford.edu
  5. [5]inventory listing