Comparison ledger
Esec Esec 2009 fS E, MRSI 505 Die Attach, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Esec 2009 fS EEsec | 505 Die AttachMRSI |
|---|---|---|
| OEM | Esec | MRSI |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | 4" | 4" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Esec Esec 2009 fS E | MRSI 505 Die Attach |
| Specifications | ||
| Product family listing | Listed among Esec die bonding products[1] | — |
| Product type | Soft solder die bonder[2] | — |
| Pick & place concept | Point-to-line pick & place with stationary indexer[3] | — |
| Net productivity | 2,500 to 8,000 UPH typical[3] | — |
| Temperature control | 8 zones, up to 450°C, ±5°C[3] | — |
| Wafer size | up to 8"[3] | — |
| Frame size | 6", 8"[3] | — |
| Die size | 0.4 x 0.4 mm - 11 x 11 mm / 16 x 16 mils - 430 x 430 mils[3] | — |
| Substrate and carrier size | Max length 285 mm; max width 60 mm[3] | — |
| Die placement accuracy | ± 80 µm / 0.6° (3σ)[3] | — |
| Wafer Size | — | 4", Also used on Substrate 3x5" and Chip on Tape[4] |
| Configuration | — | Comes with Standard Boats / Cassettes[4] |
| Also used on Substrate | — | 3x5" and Chip on Tape[4] |
| Comes with Standard Boats / Cassettes | — | Yes[4] |
| Vintage (listed unit) | — | 2001[5] |
| Description | — | Die Attach/ Multichip Module[5] |
| Version | — | assembly[5] |
| Manufacturer | — | MRSI[6] |
| Model | — | 505[6] |
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