Waferpedia

Comparison ledger

1034versusPET2

Electroglas 1034, Exatron PET2, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
1034Electroglas
PET2Exatron
OEMElectroglasExatron
CategoryTest & ProbeTest & Probe
Wafer size——
Process node——
Introduced—1997
Production run—1997–
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyElectroglas 1034Exatron PET2
Specifications
device loading—loaded and unloaded by hand or with an air wand[1]
device holding—vacuum holds the DUT in a precisely machined Face Plate[1]
alignment method—device is mechanically aligned by its body, not by its leads[1]
electrical alignment—face plate is placed onto a corresponding docking plate mounted on a printed circuit board[1]
output handling—returns the device to the operator after pass/fail, or drops devices into one of two small reject bins[1]
output tube support—can accommodate a two-tube mount for output tubes[1]
mounting options—table-top mounted, mounted directly to the test head, or mounted on a FRED (Free Rolling Exatron Dolly)[1]
power and air requirements—110/220 VAC; clean, dry air at 80 PSI/5 CFM[1]
Device type—Semi-automated prototype engineering test fixture[1]
Supported package types—Tray-borne devices such as QFPs, PQFPs, and TSOPs[1]
Functions—Device placement, alignment, and test head clamping[1]
Power requirement—110/220 VAC[1]
Air requirement—Clean, dry air at 80 PSI/5 CFM[1]

Plan your fab

Building a Test & Probe process? Get a complete equipment list.

Open the fab equipment planner →
Sources (1)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org