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Comparison ledger

F DFP 8160 Fully Automatedversus12 Lapper

Disco F DFP 8160 Fully Automated, Lapmaster 12 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
12 LapperLapmaster
OEMDiscoLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco F DFP 8160 Fully Automated—
Specifications
Voltage200VAC - 3 Phase[1]—
50/60Hz, Full Load Amps57A[1]—
Spindle Max. Revolution3000min.[1]—
Air0.5MPa.[1]—
Configuration550L/min(ANR)[1]—
Cutting Water0.3MPa. 20L/min[1]—
Cooling Water0.2MPa. 4Lmin[1]—
Outside plate diameter—12 inches[2]
Lapping Speed Range—0 to 60 rpm[3]
Wafer Size Compatibility—4 inches or smaller[2]
Input Voltage—110 V[2]
Frequency—60 Hz[2]
Phase—1[2]
Number of Rings—3[2]
Number of Weights—3[2]
Includes Slurry System—Yes[2]
Includes Timer—Yes[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]jmind.comjmind.com
  3. [3]etd.ohiolink.eduetd.ohiolink.edu