Waferpedia

Comparison ledger

DCS 1460 Wafer Cleaner Spinversus1000P

Disco DCS 1460 Wafer Cleaner Spin, YES 1000P, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMDiscoYES
CategoryWet Processing / CleanWet Processing / Clean
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones—1998 Acquisition
Control system——
Generation——
FamilyDisco DCSYES 1000P
Specifications
ConfigurationTable upgrade for VCSEL cleaning[1]Parallel plate[4]
Maximum workpiece sizeΦ300 mm[2]—
Application frame2-12[2]—
Table RPM range100 to 3,000 min⁻¹[2]—
Setting time for cleaning/drying0 to 999 sec[2]—
Cleaning nozzle speed1 to 37.5 °/sec[2]—
Cleaning rangeΦ450 mm (up to 310 x 310 mm)[2]—
Cleaning pressure range2.3 to 11.8 MPa[2]—
Equipment dimensions (W×D×H)500 × 650 × 1,220 mm[2]—
Equipment weight (Dry mass)Approx. 144 kg[2]—
Max. workpiece sizeΦ300 mm[2]—
Table RPM100 to 3,000 min^-1[2]—
Cleaning nozzlesStandard high pressure cleaning nozzle; optional atomizing cleaning nozzle; dual nozzle configuration possible[2]—
Operator interface4 inch LCD touch panel[2]—
Model—1000P[3]
System type—Plasma cleaning system[3]
Shelf configuration—Four 16 x 16 inch shelves[3]
Total capacity—1024 square inches[3]
Control system—PLC driven with plain English real time process readout and diagnostics in the event of system abort[3]
Number of shelves—4[3]
Shelf size—16 x 16 inches[3]
Power—1000 W[4]
Operation modes—Active, RIE, Downstream[3]
Sample size range—From smallest semiconductor chip to large flat panels[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]disco.com.sgdisco.com.sg
  3. [3]web.archive.orgweb.archive.org
  4. [4]semistarcorp.comsemistarcorp.com