Waferpedia

Comparison ledger

DAD 3231 Automatic Dicingversus15

Disco DAD 3231 Automatic Dicing, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
15Lapmaster
OEMDiscoLapmaster
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco DADLapmaster 15
Specifications
ConfigurationIncludes:[1]—
Power2.0 kW Non-Siezing Air Bearing Spindle[1]—
Max workpiece sizeΦ6 inch (150 mm × 150 mm optional accessory)[2]—
X-axis cutting range210 mm[2]—
Cutting speed0.1 to 800 mm/s[2]—
Y-axis cutting range162 mm[2]—
Y-axis index step0.0001 mm[2]—
Y-axis index positioning accuracy0.005/185 mm (Single error), 0.003/5 mm[2]—
Z-axis max stroke31.2 mm (Φ2 inch blades)[2]—
Z-axis moving resolution0.000002 mm[2]—
Z-axis repeatability accuracy0.001 mm[2]—
θ-axis max rotating angle320 deg[2]—
Spindle layoutSingle[2]—
Rated output2.0 kW at 40,000 min-1[2]—
Rated torque0.48 N·m[2]—
Rotation speed range3,000 to 40,000 min-1[2]—
Equipment dimensions (W × D × H)650 × 950 × 1,670 mm[2]—
Equipment weightApprox. 550 kg[2]—
Automatic alignmentYes[2]—
Auto focusYes[2]—
Auto kerf checkYes[2]—
Input Power—110 Vac[3]
Plate Diameter—15 inches (381 mm)[4]
Number of Conditioning Rings—3[4]
Ring ID—5.5 inches (140 mm)[4]
Standard RPM—60[4]
RPM Range (Variable Speed Drive)—0-60[4]
Drive Motor - Lapper—0.5 HP (0.37 kW)[4]
Drive Motor - Polisher—0.75 HP (0.56 kW)[4]
Length—25 inches (635 mm)[4]
Width—20 inches (508 mm)[4]
Height—24 inches (610 mm)[4]
Estimated Shipping Weight—285 lbs (129.3 kg)[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org
  3. [3]inventory listing
  4. [4]web.archive.orgweb.archive.org