Waferpedia

Comparison ledger

3220versusMWS-44SN

Disco 3220, Takatori MWS-44SN, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
3220Disco
MWS-44SNTakatori
OEMDiscoTakatori
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco 3220Takatori MWS-44SN
Specifications
equipment typedicing saw[1]—
Workplace sizeø150 mm[2]—
Spindle layoutSingle[2]—
Spindle output1.5 kW at 30,000 min-1[2]—
Spindle max revolution speed40,000 min-1[2]—
X-axis feed speed range0.1 – 500 mm/s[2]—
Y-axis index step0.0001 mm[2]—
Z-axis repeating accuracy0.001 mm[2]—
Z-axis max blade sizeø58 mm[2]—
Equipment type—Multi Wire Saw[3]
Product line—MWS[3]
Process category—Slicing and grinding[3]
Machine type—Multi wire saw[3]
Rocking motion-slicing mechanism—Allows easier abrasive outlet and smoothness of cutting surface to simplify subsequent processes[4]
Slurry supply—Effective lapping with slurry supplied from the nearest nozzle to the works for uniform and precise cutting[4]
Wire control—Direct drive system[4]
Wire control benefit—Saves space and allows speedy cutting[4]
Wire tension control—Electric control with stable wire tension[4]
Control method—Microcomputer-controlled cutting conditions for various work pieces[4]
Cutting recipes—60 cutting recipes settable[4]
Wire winding—Automatic wire winding[4]
Slurry compatibility—Diamond slurry compatible[4]
Listed materials—Sapphire, SiC, GaN, Quartz Crystal, Ceramic[5]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]nanofab.utah.edunanofab.utah.edu
  2. [2]semistarcorp.comsemistarcorp.com
  3. [3]takatori-g.co.jptakatori-g.co.jp
  4. [4]takatori-g.co.jptakatori-g.co.jp
  5. [5]diagon.aidiagon.ai