Waferpedia

Comparison ledger

321versusDAD3241

Disco 321, Disco DAD3241, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
321Disco
DAD3241Disco
OEMDiscoDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size—up to Φ8”
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco 321Disco DAD3241
Specifications
OEMDisco[1]—
Model321[1]—
Equipment typeWafer Dicing Saw[1]—
Facility contextCleanroom Instrumentation[1]—
Application areaNano and Micro Fabrication[1]—
LocationFNT 4.106[1]—
Wafer SizeUp to 6 inches[2]—
Spindle Power1.0 kW Synchro Spindle (or 1.5 kW Synchro Spindle in some configurations)[3]—
Spindle Power (alternate)1500 Watt spindle[2]—
Non-Contact SetupNon Contact Setup[3]—
MicroscopeMicroscope With Eyepiece and Shutter (or Dual Objective Microscope With Eyepiece)[3]Built-in microscope[4]
Broken Blade DetectionBroken Blade Detection[3]—
Light TowerIncludes Light Tower[3]—
Chuck Type6" Universal Chuck (or 6" Porous Film Frame Chuck)[2]—
Wafer size capabilityUp to 6" wafers[3]—
Chuck6-inch porous film frame chuck[2]—
Spindle power1500-watt spindle[2]—
FootprintSmall footprint[2]—
SetupNon-contact setup[3]—
Blade break detectionBroken blade detection[3]—
Other featuresFloppy drive, light tower, blade tools, manuals[3]—
Max. workpiece size—Φ8”[4]
X-/Y-axis cutting range—210 mm[4]
Cutting speed—0.1-800 mm/s[4]
Index positioning accuracy—0.002/210 mm[4]
Z-axis max. stroke—32.2 mm[4]
Moving resolution—0.000002 mm[4]
Repeatability accuracy—0.001 mm[4]
Θ-axis max. rotating angle—320°[4]
Rotation speed range—6,000-60,000 rpm[4]
X-axis cutting range—210 mm[4]
Y-axis cutting range—210 mm[4]
Spindle rated output—1.8 kW at 60,000 min-1[6]
Spindle rated torque—0.29 N·m[6]
Equipment dimensions—650 × 950 × 1,670 mm[6]
Equipment weight—Approx. 550 kg[6]
Axis drive—Servo motors on all axes (X, Y, and Z)[5]
Interface—XIS (Extended Interface System)[5]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (6)Every fact above is drawn from these public sources
  1. [1]tmi.utexas.edutmi.utexas.edu
  2. [2]jmind.comjmind.com
  3. [3]gtsaz.comgtsaz.com
  4. [4]aggiefab.tamu.eduaggiefab.tamu.edu
  5. [5]disco.com.sgdisco.com.sg
  6. [6]disco.co.jpdisco.co.jp