Waferpedia

Comparison ledger

SE600versusUltra-55

CHA SE600, Zeiss Ultra-55, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMCHAZeiss
CategoryLithographyLithography
Wafer size300mm300mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyCHA SE600Zeiss Ultra-55
Specifications
Tool typeElectron Beam Lithography System[1]—
Substrate range10 mm pieces up to 300 mm wafers[1]—
Minimum feature sizeless than 10 nm[1]—
Equipment typeElectron beam evaporator[2]—
Alternate descriptionGold evaporator[3]—
ManufacturerCHA[2]—
Part numberSE600[3]—
Unit vintage date01.06.1980[2]—
Installed accessory—Zyvex S-100 Nanoprobes installed on the Zeiss Ultra-55 SEM[1]
Operating condition—Operate under vacuum during imaging or with the beam blanked[1]
Probe count—Three individually controlled nanoprobes[1]
Placement precision—Five nanometers[1]
Minimum tip radius—Fifty nanometers[1]
Category—Lithography[4]
Wafer size—300mm[4]
Instrument type—Field emission scanning electron microscope (FESEM)[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]cnf.cornell.educnf.cornell.edu
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]semi-sps.comsemi-sps.com
  4. [4]waferpedia.comwaferpedia.com
  5. [5]fazeltafti.comfazeltafti.com