Comparison ledger
CEE 100, OAI 806, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100CEE | 806OAI |
|---|---|---|
| OEM | CEE | OAI |
| Category | Lithography | Lithography |
| Wafer size | 6" | 6" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 100 | OAI 806 |
| Cited variants |
| — |
| Specifications | ||
| Tool type | Spray Developer[1] | — |
| Accepts wafer size | up to 6" wafers[2] | — |
| Programmable programs | 10 programs[2] | — |
| Steps per program | up to 10 steps[2] | — |
| Programmable step parameters | Acceleration, Speed, Time[2] | — |
| Associated document | CEE Model 100CB Spinner.doc[2] | — |
| Wafer size | Up to 6 inches[2] | — |
| Programs | 10 programs each with up to 10 steps[2] | — |
| Control parameters | Acceleration, Speed, Time[2] | — |
| Model | — | OAI 806 Mask Aligner[3] |
| Patterning substrate size | — | up to 6 inches[3] |
| Contact modes | — | soft, hard, and proximity contact modes[3] |
| Alignment accuracy | — | submicron[3] |
| UV source | — | collimated UV light source[3] |
| Workholding | — | vacuum chuck[3] |
| Optics | — | integrated microscope optics[3] |
| Stage | — | motorized stage[3] |
| Optional capability | — | backside alignment[3] |
| Substrate size | — | up to 6 inches[3] |
| Light source | — | collimated UV[3] |
| Backside alignment | — | optional[3] |
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