Comparison ledger
CEE 100, Hamatech HMR900, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 100CEE | HMR900Hamatech |
|---|---|---|
| OEM | CEE | Hamatech |
| Category | Lithography | Lithography |
| Wafer size | 6" | 4" |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | CEE 100 | Hamatech HMR900 |
| Cited variants |
| — |
| Specifications | ||
| Tool type | Spray Developer[1] | Mask processor[3] |
| Accepts wafer size | up to 6" wafers[2] | — |
| Programmable programs | 10 programs[2] | — |
| Steps per program | up to 10 steps[2] | — |
| Programmable step parameters | Acceleration, Speed, Time[2] | — |
| Associated document | CEE Model 100CB Spinner.doc[2] | — |
| Wafer size | Up to 6 inches[2] | — |
| Programs | 10 programs each with up to 10 steps[2] | — |
| Control parameters | Acceleration, Speed, Time[2] | — |
| Primary use | — | Cr-plate wet processing or cleaning[3] |
| Installed media | — | Developing exposed resist (AZ 351B developer), Cr wet etching (TechniEtch Cr N°1), and resist stripping (AZ 400K non-diluted)[3] |
| Substrate size | — | Square plates up to 7" x 7"[3] |
| Supported chuck sizes | — | 4" x 4", 5" x 5", 6" x 6", and 7" x 7" square plates[3] |
| Loading | — | Manual loading and unloading of substrates[3] |
| Rotation | — | Direct and reverse rotation (CW, CCW)[3] |
| Speed accuracy | — | +/-1 rpm[3] |
| Programmable recipes | — | 20 recipes with 50 steps each[3] |
| Substrate fixation | — | Mechanical side edge substrate fixation; chucks for Cr plates do not use vacuum clamping[3] |
| Substrate handling | — | Manual loading and unloading[3] |
| Chuck size | — | 4" x 4", 5" x 5", 6" x 6", 7" x 7" square plates[3] |
| Recipe capacity | — | 20 recipes, 50 steps each[3] |
| Chemical media | — | AZ 351B developer, TechniEtch Cr N°1, AZ 400K non-diluted, with DI water rinse and drying[3] |
| Equipment type | — | Mask processor[3] |
| Process type | — | Cr-plate wet processing or cleaning[3] |
| Chemical treatment 1 | — | Developing exposed resist with AZ 351B developer[3] |
| Chemical treatment 2 | — | Cr wet etching with TechniEtch Cr N°1[3] |
| Chemical treatment 3 | — | Resist stripping with AZ 400K non-diluted[3] |
| Rinse and dry | — | Intermediate DI water rinse steps and final drying[3] |
| Supported mask and reticle types | — | 4, 5 and 7 inch masks for mask-aligner usage; 6 inch reticules for DUV stepper usage[3] |
| Recipe capability | — | 20 recipes with 50 steps each can be programmed[3] |
| Operation | — | manual loading and unloading of the substrates[3] |
| Substrate format | — | square plates up to 7" x 7"[3] |
| Supported plate sizes | — | 4" x 4", 5" x 5", 6" x 6", 7" x 7"[3] |
| Chuck type | — | multi-size chuck for square plates[3] |
| Acceleration / speed accuracy | — | smooth acceleration and speed accuracy +/-1 rpm[3] |
| Process steps | — | developing exposed resist, Cr wet etching, resist stripping, intermediate DI water rinse steps, and final drying[3] |
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