Waferpedia

Comparison ledger

IGF 6680 Fversus1000 Hot Plate

Blue M IGF 6680 F, CEE 1000 Hot Plate, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMBlue MCEE
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlue M IGF 6680 FCEE 1000 Hot Plate
Cited variants
  • IGF-6680F-4[1]
  • IGF 6680 F F4T[2]
—
Specifications
Wafer Sizes12 inch[3]—
Maximum Temperature593°C[1]—
Inside Dimensions19"L x 18"W x 19.5"H[1]—
Voltage208/240V, 3Ph, 60Hz, 38.4A[1]—
AtmosphereInert gas[1]—
ManufacturerBlue M[3]—
ModelIGF 6680 F[3]—
Equipment typeCure Oven[3]—
Wafer size12 inch[3]—
Model variantIGF-6680F-4[1]—
ControllerDigital programmable controller[1]—
Overtemperature controlOvertemperature controller[1]—
Gas inputInert gas input[1]—
Electrical208/240V, 3Ph, 60Hz, 38.4A[1]—
MakeBlue M[3]—
TypeCure Oven[3]Hot Plate[4]
Digital programmable controllerpresent[1]—
Overtemperature controllerpresent[1]—
Inert gas inputpresent[1]—
DimensionsInside dimensions 19"L x 18"W x 19.5"H[1]—
Configuration—4"[4]
Wafer Size—4 inch[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]bidservice.combidservice.com
  2. [2]thermalproductsolutions.comthermalproductsolutions.com
  3. [3]Equipment inventory listing
  4. [4]inventory listing