Waferpedia

Comparison ledger

Dryingversus1000 Hot Plate

Blue M Drying, CEE 1000 Hot Plate, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
DryingBlue M
OEMBlue MCEE
CategoryThermal / DiffusionThermal / Diffusion
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlue M DryingCEE 1000 Hot Plate
Cited variants
  • OV-8A Drying Oven[1]
—
Specifications
Equipment typeDrying oven[2]—
Model designation-[2]—
Variant designationOV-8A Drying Oven[1]—
Power Selector low settingup to 120°C (248°F)[1]—
Power Selector medium setting120°C to 180°C (356°F)[1]—
Power Selector high setting180°C to 260°C (500°F)[1]—
Explosion-proofNot explosion proof[1]—
Configuration—4"[3]
Type—Hot Plate[3]
Wafer Size—4 inch[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]wiki.nanofab.usc.eduwiki.nanofab.usc.edu
  2. [2]Equipment inventory listing
  3. [3]inventory listing