Comparison ledger
Blue M 0 V 500, CEE 200 Bake Plate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0 V 500Blue M | |
|---|---|---|
| OEM | Blue M | CEE |
| Category | Thermal / Diffusion | Thermal / Diffusion |
| Wafer size | — | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Blue M 0 V 500 | CEE 200 |
| Specifications | ||
| Wafer size | — | up to 200mm wafer[1] |
| Software | — | Internal OS[1] |
| Voltage | — | 208V[1] |
| Wafer Size | — | up to 200 mm[2] |
| Maximum Temperature | — | 300 °C[2] |
| Bake Methods | — | Hard contact, Proximity (lift 25-100 μm using N2)[2] |
| Exhaust Cover | — | Yes (removal of fume)[2] |
| Smart Pins for Temperature Control | — | Yes[2] |
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