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22 AD 42versusKR15

Blanchard 22 AD 42, Disco KR15, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
22 AD 42Blanchard
KR15Disco
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size—8"
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 22 AD 42Disco KR15
Cited variants—
  • KR15-A/KR15-B[1]
Specifications
Phase3 Phase[2]—
Frequency60 Hz[2]—
Voltage120 Vac[2]—
ConfigurationNo coolant tank[2]—
Blade designation—Disco KR15[3]
Blade thickness—200 micron[3]
Blade grit—low grit[3]
Intended materials—sapphire, glass, and silicon[3]
Max. workpiece size—Φ8"[3]
Thickness—200 micron[3]
Grit—Low grit[3]
Materials—sapphire, glass, and silicon[3]
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Sources (3)Every fact above is drawn from these public sources
  1. [1]thk.comthk.com
  2. [2]inventory listing
  3. [3]aggiefab.tamu.eduaggiefab.tamu.edu