Waferpedia

Comparison ledger

22 AD 42versusDFL 7160 Automatic

Blanchard 22 AD 42, Disco DFL 7160 Automatic, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
22 AD 42Blanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 22 AD 42Disco DFL 7160
Cited variants—
  • DFL 7160 Laser Dicing[1]
Specifications
Phase3 Phase[2]—
Frequency60 Hz[2]—
Voltage120 Vac[2]—
ConfigurationNo coolant tank[2]1 Cassette port[3]
Wafer Size—12 inch[3]
Cassette Ports—1[3]
Dicing—Yes[4]
Circular Ring Cutting of Taiko Wafers—Yes[4]
Automation—Automatic[1]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com