Comparison ledger
Blanchard 20 36 Surface, Takatori MWS-812SD, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 20 36 SurfaceBlanchard | MWS-812SDTakatori |
|---|---|---|
| OEM | Blanchard | Takatori |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Blanchard 20 36 Surface | Takatori MWS-812SD |
| Specifications | ||
| Configuration | With new Elecro-Matic Neutrol II Magnetic Chuck Control[1] | — |
| Magnetic Chuck Control | Electro-Matic Neutrol II[1] | — |
| Tool type | — | Multi Wire Saw[2] |
| Lineup | — | MWS[2] |
| Main material capable of slicing | — | SiC, GaN, LT, LN, ALN, SiN, Ga2O3, Sapphire, Crystal, GaAs, GaP, InP, Neodymium magnet, Ceramics, Resin, Metal, Platinum, Silver, Gold, and any other hard brittle material[2] |
| Stated capabilities | — | Variable processing conditions such as a thin wire, a high wire tension, a fast wire running, or an extra-long time slicing process[2] |
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