Waferpedia

Comparison ledger

20 36 SurfaceversusGLP-150

Blanchard 20 36 Surface, Takatori GLP-150, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
20 36 SurfaceBlanchard
GLP-150Takatori
OEMBlanchardTakatori
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 20 36 SurfaceTakatori GLP-150
Specifications
ConfigurationWith new Elecro-Matic Neutrol II Magnetic Chuck Control[1]—
Magnetic Chuck ControlElectro-Matic Neutrol II[1]—
Structure—High rigidity[2]
Accuracy—Outstanding thickness accuracy in any materials[2]
Grindstone adaptability—Adaptable to various grindstones[2]
Automation—Adopted to automation[2]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]takatori-g.co.jptakatori-g.co.jp