Waferpedia

Comparison ledger

20 36 SurfaceversusTS 23 ID

Blanchard 20 36 Surface, Meyer Burger TS 23 ID, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
20 36 SurfaceBlanchard
TS 23 IDMeyer Burger
OEMBlanchardMeyer Burger
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 20 36 SurfaceMeyer Burger TS 23 ID
Specifications
ConfigurationWith new Elecro-Matic Neutrol II Magnetic Chuck Control[1]Refurbished in 2020[2]
Magnetic Chuck ControlElectro-Matic Neutrol II[1]—
Make—Meyer Burger[3]
Model—TS 23[3]
Equipment type—ID Saw[3]
Vintage (one unit)—1985[2]
Refurbished (one unit)—Refurbished in 2020[2]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]Equipment inventory listing