Waferpedia

Comparison ledger

20 36 SurfaceversusDFL 7340 Laser Dicing

Blanchard 20 36 Surface, Disco DFL 7340 Laser Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
20 36 SurfaceBlanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 20 36 SurfaceDisco DFL 7340
Specifications
ConfigurationWith new Elecro-Matic Neutrol II Magnetic Chuck Control[1]—
Magnetic Chuck ControlElectro-Matic Neutrol II[1]—
Phase—3 phase[2]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing