Waferpedia

Comparison ledger

20 36 SurfaceversusDAD 3220 Automatic Dicing

Blanchard 20 36 Surface, Disco DAD 3220 Automatic Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
20 36 SurfaceBlanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 20 36 SurfaceDisco DAD
Specifications
ConfigurationWith new Elecro-Matic Neutrol II Magnetic Chuck Control[1]1000 Watt Spindle[3]
Magnetic Chuck ControlElectro-Matic Neutrol II[1]—
Spindle—1.5 kw[2]
Objective lens—7.5 x[2]
Phase—3 Phase[6]
Full Load Current—10 A[6]
Main Breaker Rating—15 A[6]
Largest Load Rating—8 A[6]
Spindle power—1.5 kW[2]
Spindle speed—40,000 min−1[4]
Wafer size—6 inch[7]
Spindle power (version 1)—1.5 kw[2]
Spindle power (version 2)—1000 Watt[3]
Spindle revolutions—40,000 min[4]
Included components (example configuration)—Chuck Table, Manuals (flash drive), Blade Removal Tools, Floppy Drive, Monitor, BBD, NCS, Flow Sensors, Alarm Lights[3]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (7)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]inventory listing
  6. [6]inventory listing
  7. [7]Equipment inventory listing