Waferpedia

Comparison ledger

18 D SurfaceversusR07

Blanchard 18 D Surface, Disco R07, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
R07Disco
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size—up to Φ8”
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceDisco R07
Cited variants—
  • R07-SDC600-BB101-75[1]
  • R07-SD400-BB200-75[1]
  • R07-SDC400-BB300-75[1]
  • R07-SDC400-BB500-75[1]
Specifications
Voltage416 V[2]—
Phase3 Phase[2]—
Cycles50[2]—
Control Voltage110[2]—
MakeBlanchard[2]—
Model18 D[2]DAD3241[4]
Asset #153970[2]—
Power416 V, 3 phase[2]—
Max. workpiece size—Φ8”[4]
X-/Y-axis cutting range—210 mm[4]
Cutting speed—0.1-800 mm/s[4]
Index positioning accuracy—0.002/210 mm[4]
Z-axis max. stroke—32.2 mm[4]
Moving resolution—0.000002 mm[4]
Repeatability accuracy—0.001 mm[4]
Θ-axis max. rotating angle—320°[4]
Rotation speed range—6,000-60,000 rpm[4]
Spindle power—1.8 kW[4]
Type—Resin bond blades[1]
Applications—Glass, quartz, ceramics, etc.[1]
Major uses—Glass (borosilicate glass, non-alkali glass), crystal, ceramics, QFN, metal, quartz, alumina, LTCC, aluminum nitride[1]
Wafer size—up to Φ8”[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]disco.co.jpdisco.co.jp
  2. [2]inventory listing
  3. [3]Equipment inventory listing
  4. [4]aggiefab.tamu.eduaggiefab.tamu.edu