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Comparison ledger

18 D SurfaceversusDFG 8830

Blanchard 18 D Surface, Disco DFG 8830, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceDisco DFG
Specifications
Voltage416 V[1]—
Phase3 Phase[1]3 Phase[3]
Cycles50[1]—
Control Voltage110[1]—
MakeBlanchard[1]—
Model18 D[1]—
Asset #153970[1]—
Power416 V, 3 phase[1]—
Configuration—In-Feed[3]
Wafer size—6 inch, 8 inch[3]
Material—SiC (silicon carbide)[3]
Max workpiece size—ø150 mm[4]
Spindle quantity—4[4]
Spindle power (Z1–Z3)—6.3 kW[4]
Spindle speed (Z1–Z3)—1,000–4,000 min⁻¹[4]
Work disc quantity—5[4]
Dimensions (W×D×H)—1,400 × 2,500 × 2,000 mm[4]
Weight—≈6,000 kg[4]
Maximum workpiece size—150 mm (6 inch)[4]
Wafer sizes supported—6 inch and 8 inch[3]
Spindle count—4[4]
Spindle speed range—1,000 – 4,000 min⁻¹[4]
Number of work stations—5[4]
Dimensions (W x D x H)—1,400 x 2,500 x 2,000 mm[4]
Material compatibility—SiC[3]
In-feed capability—Yes[3]
Power supply—3 Phase, 3 Wire + Ground, 60 A[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing
  3. [3]inventory listing
  4. [4]web.archive.orgweb.archive.org