Waferpedia

Comparison ledger

18 D SurfaceversusDFD 651 Automatic Dicing

Blanchard 18 D Surface, Disco DFD 651 Automatic Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceDisco DFD
Specifications
Voltage416 V[1]—
Phase3 Phase[1]—
Cycles50[1]—
Control Voltage110[1]—
MakeBlanchard[1]Disco[3]
Model18 D[1]DFD 651[3]
Asset #153970[1]—
Power416 V, 3 phase[1]—
Configuration—Non-operational[3]
Type—Automatic Dicing Saw[3]
Wafer Sizes—6 inch, 8 inch[4]
Spindle—Dual 1000W Synchro Spindle[5]
Alignment—Macro/Micro Automatic Alignment[5]
Cleaning Unit—High Pressure Spinner Cleaning Unit[5]
Setup—Non Contact Setup[5]
Broken Blade Detector—Yes[5]
Theta—Motorized 360°[5]
Monitor—12-inch Monitor with Camera[5]
Chuck Table—8-inch Universal Chuck Table[5]
BBD and NCS—Yes[6]
Chuck—8-inch Porous Chuck[6]
Product type—Automatic Dicing Saw[3]
Operation—Automatic[3]
Wafer size—6, 8 inch[4]
OEM—Disco[3]
Equipment type—Automatic dicing saw[3]
Vintage—1999[4]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing
  3. [3]inventory listing
  4. [4]Equipment inventory listing
  5. [5]gtsaz.comgtsaz.com
  6. [6]classoneequipment.comclassoneequipment.com