Waferpedia

Comparison ledger

MCU 200versus100 ICP Fluorine

Axcelis MCU 200, Oxford Instruments 100 ICP Fluorine, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
MCU 200Axcelis
100 ICP FluorineOxford Instruments
OEMAxcelisOxford Instruments
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—Oxford Instruments 100 ICP Fluorine
Specifications
OEMAxcelis[1]—
ModelMCU 200[1]—
CategoryEtch[2]—
Wafer sizes8 inch[1]—
Descriptionstripper / asher[2]—
Version200 mm[2]—
Etch Gases—SF6, CF4, O2, Ar, N2, CHF3, C4F8[3]
Cryo DRIE etch rate—up to 5 µm/min[3]
Wafer size—4 inch, 6 inch, 8 inch (with clamp change)[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]nanofab.utah.edunanofab.utah.edu