Waferpedia

Comparison ledger

200 PCUversusViision 200 + High Current

Axcelis 200 PCU, Varian Viision 200 + High Current, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
200 PCUAxcelis
OEMAxcelisVarian
CategoryIon ImplantationIon Implantation
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones2000 Vintage—
Control system——
Generation——
FamilyAxcelis NV GSD 200Varian Viision 200 + High Current
Cited variants
  • Fusion 200 PCU[1]
  • Fusion 200 PCU-P[2]
—
Specifications
P/NSC 4840 A[3]—
Frequency50 Hz[3]—
Phase3 Phase[3]—
Voltage400 V[3]—
Wafer size—200 mm[4]
Power requirements—208 V, 140 A, 50/60 Hz, 3 Phase[5]
Cassette to cassette—Yes[5]
Bernas ion source—Yes[4]
Two-dimensional beam profiler—Yes[4]
CE-marked—Yes[4]
Computer system—147 MHz Main & ES CPU[4]
Cryo pumps—4× CTI 250F, 2× CTI 9600 compressors[4]
Frequency kit—50 Hz[4]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]exapro.comexapro.com
  2. [2]fabsurplus.comfabsurplus.com
  3. [3]inventory listing
  4. [4]fabsurplus.comfabsurplus.com
  5. [5]surplus.infineon.comsurplus.infineon.com