Comparison ledger
Axcelis 200 MCU Exposure, EV Group 101, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 200 MCU ExposureAxcelis | 101EV Group |
|---|---|---|
| OEM | Axcelis | EV Group |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Axcelis 200 MCU Exposure | EV Group 101 |
| Specifications | ||
| OEM | — | EV Group[1] |
| Model | — | 101[1] |
| Equipment name | — | EVG 101 Spray Coater[1] |
| NEMO ID | — | evgspraycoat[1] |
| Training required | — | EVG 101 Training[1] |
| Training duration | — | 1.50 hours[1] |
| Processing technique | — | Resist Spray Coat (manual)[1] |
| Cleanliness | — | "All"[1] |
| Location | — | SNF Paul G Allen L107 Cleanroom[1] |
| Wafer diameter (substrate size) | — | up to 300 mm[2] |
| Available modules | — | Spin coat / OmniSpray® / develop[2] |
| Wafer handling options | — | Bowed / warped / thin wafer handling, edge handling[2] |
| Dispense options | — | Various resist dispense pumps covering viscosities up to 52000 cP; constant pressure dispense systems; EBR / BSR / pre-wet / bowl wash / liquid priming[2] |
| Processing technique (at SNF) | — | Resist Spray Coat (manual)[3] |
| Cleanliness group (at SNF) | — | "All"[1] |
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